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Ticker Symbol: WBEMF

Winbond Electronics Corporation - GDR - Reg S

Exchange: US OTC Country: TW Currency: USD Asset Type: ADR

Company Profile

Winbond Electronics Corp. engages in the design, development, manufacture and marketing of integrated circuits and related products. It operates through the following segments: DRAM IC, Flash Memory, and Logic IC Products. The DRAM IC Product segment deals with the manufacturing, selling, researching, designing, and after-sales service of mobile RAM, specialty RAM, graphic RAM, and commodity RAM. The Flash Memory Product segment handles the production, sales, research, design, and after-sales service of the flash memory product. The Logic IC Product segment engages in the fabrication, examination, outlining, disposal, and after-sales service of the Logic IC product. The company was founded on September 29, 1987 and is headquartered in Taichung, Taiwan.

Sector: Electronic Technology
Industry: Semiconductors
Standard Industrial Classification Code (SIC code): 3672
Address: No. 8, Keya 1st Road
CEO: Yu Chun Chiao
Tags:
  • Semiconductors
  • Electronic Technology

Pricing

Last Updated: December 31, 1969 07:00 PM EST
Previous Close: -
Change: - ( 0.00%)
Days Range: - - -
Beta: -
52wk. High: -
52wk. Low: -
Ytd. Change 0.00%
50 Day Moving Average: -
200 Day Moving Average: -
Shares Outstanding: 24560000

Valuation

Market Cap: -
PE Ratio: -
EPS (TTM): 0

Dividends

Dividend Per Share (TTM): $0.07
Dividend Yield (TTM): 0.00%
Ex-Dividend Date: July 12, 2021